Products
Sputtering Targets
High-purity planar & rotary targets for semiconductors, displays, and advanced packaging.
Planar Target —
High-purity planar target for PVD processes.
Rotary Target —
Rotary design for long life and uniform deposition.
Alloy Target —
Tailored composition for specific film properties.
Refractory Metals: W, Mo, Ta
High-temperature, corrosion-resistant metals for semiconductor and vacuum applications.
Tungsten (W) —
High density and melting point for demanding use.
Molybdenum (Mo) —
Excellent thermal conductivity and stability.
Tantalum (Ta) —
Superior corrosion resistance for harsh processes.
FOPLP, CoWoS, TSV
Materials and components enabling advanced packaging and panel-level integration.
FOPLP Material —
Materials engineered for panel-level packaging.
CoWoS Solution —
Support materials for 2.5D/3D integration.
TSV Application —
Optimized metals and targets for TSV processes.
Ion Implantation Parts
Refractory metal components engineered for ion sources and implanter systems.
Ion Source Component — 1
Precision machined W/Mo/Ta assemblies.
Beamline Part — 2
Durable design for stability and lifetime.
Insulator/Assembly — 3
Built for precision and predictable performance.
Customized Products
Tailor-made targets, alloys, and components for your specific process needs.
Custom —
Geometry and composition per spec.
Prototype Alloy —
R&D alloys and small-lot builds.
Special Machining —
Complex parts with tight tolerances.
